Shipping Officer

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Logistics | Freight Forwarding and Operations | Import Export Administrative Assistant / Shipping Assistant
Job Type:
Full Time
Permanent
Job Suitable For:
#freshgrads#skills-training
Benefits:

health & wellness benefits

training opportunities

No. of Vacancies:

1

Job Description

Job Description:

  • Arrange shipment using various reports.
  • Ensures company policies and procedures are reviewed often and notifies the Shipping & Receiving Manager when such policies or procedures may need to be revised to increase work efficiency in the department.
  • Maintains inventory of shipping materials and supplies and raise ePR.
  • Arrange expired boards for baking prior shipment and prepare RSN log book.
  • Coordinates import/export of goods by scheduling containers to meet shipping demands.
  • Monitors the quality, quantity, cost and efficiency of inbound and outbound shipments.
  • Interfaces with CS, Kitter, PC regarding product delivery time schedules, coordinates carries acceptance programs.
  • Recommends and assists in implementing operating procedures and promotes continual improvement within the department and the company.

 

Job Requirements:

  • Proficiency in MS Excel, Google, knowledge in Oracle application preferred; with basic in MRP.
  • Good communication skills
  • Min 2-3 years working experience in related field.
Job Criteria/Requirements
Qualifications:

NITEC

Must-have skills:

Meticulous

Nice to Have Skills:

know how to use Excel and Oracle

Employer Profile
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Sanmina-SCI (Penjuru)

The Sanmina Penjuru, Singapore facility develops and produces advanced printed circuit boards (PCBs) for leading high technology companies in the optical, networking, medical, defense & aerospace and automotive industries. We specialize in high-density, microelectronic PCBs with mid-to-high layer counts. With 240,000 square feet of manufacturing capacity, our facility offers the flexibility to support quick turnarounds and New Product Introduction (NPI). Our Penjuru facility offers a number of PCB technologies including rigid-flex, fiber optic, sequential lamination/ subassemblies, heavy copper, via-in-pad-plated-over (VIPPO), and high density interconnect (HDI) technology.